10.1. PREPARATION•••• PbF (: Pb free) Solder•••• Soldering IronTip Temperature of 700∞F ± 20∞F (370∞C ± 10∞C)Note: We recommend a 30 to 40 Watt soldering iron. Anexpert may be able to use a 60 to 80 Watt iron wheresomeone with less experience could overheat and damagethe PCB foil.•••• FluxRecommended Flux: Specific Gravity → 0.82.Type → RMA (lower residue, non-cleaning type)Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free)(P.4).10.2. REMOVAL PROCEDURE1. Put plenty of solder on the IC pins so that the pins can becompletely covered.Note:If the IC pins are not soldered enough, you may givepressure to the P.C. board when cutting the pins with acutter.2. Make a few cuts into the joint (between the IC and its pins)first and then cut off the pins thoroughly.3. While the solder melts, remove it together with the IC pins.When you attach a new IC to the board, remove all solderleft on the land with some tools like a soldering wire. If somesolder is left at the joint on the board, the new IC will not beattached properly.10.3. INSTALLATION PROCEDURE1. Tack the flat pack IC to the PCB by temporarily solderingtwo diagonally opposite pins in the correct positions on thePCB.Be certain each pin is located over thecorrect pad on the PCB.2. Apply flux to all of the pins on the IC.3. Being careful to not unsolder the tack points, slide thesoldering iron along the tips of the pins while feedingenough solder to the tip so that it flows under the pins asthey are heated.10.4. REMOVING SOLDER FROMBETWEEN PINS1. Add a small amount of solder to the bridged pins.2. With a hot iron, use a sweeping motion along the flat part ofthe pin to draw the solder from between the adjacent pads.10 HOW TO REPLACE A FLAT PACKAGE ICEven if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount),a soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.73KX-TVM200E / KX-TVM200NE