Page 2 193C-E-EMA0Z-A01-05MMachine adjust ................................................. 2-3Machine config ................................................. 2-3Machine parameter .......................................... 2-3Main option .................................................... 1-11Maintenance..................................................... 2-7Mask and solder recognition .......................... 5-15Mask cleaning ..........................................7-1, 7-6Mask cleaning unit for small frame................. 1-13Mask data ...................................................... 4-17Mask recog ...................................................... 7-1Mask recognition .................................... 4-41, 7-7Mask ref origin ................................................. 4-8Mask registration No. ..................................... 4-17Mask size ....................................................... 4-17Mask/Solder recognition data ........................ 4-22Mask-release speed changeover ................... 4-27Uniform-velocity mode ........................... 4-27Acceleration mode ................................. 4-27Multiple mode .........................................4-27Matrix plate ....................................................1-12Menu bar .......................................................... 4-8Menu tree functions ......................................... 2-4Method ...........................................................4-29Motion mode .................................................. 4-29Movement principle .......................................... 1-5NNew type of cleaning unit ................................. 1-3OOrigin offset .................................................... 4-11Outer size ......................................................... 1-8Output check .......................................... 7-1, 7-12PPackage teaching .......................................... 5-28Pass Mode .....................................................4-41Paste count ....................................................4-32PatternLibrary................................................... 4-7PCB transfer..................................................... 7-3Performance info .............................................. 2-3Pickup block ................................................... 1-12Plate-making reference ..................................4-18Plate-making reference origin ........................ 4-20Precautions for registering recognition data .... 5-5Preview ..........................................................4-43Previous / Next ................................................. 4-7Print operation .................................................. 7-1Print position teaching .................................... 5-22Print pressure teaching ..................................5-26Printing ............................................................. 7-5Printing conditions data ..................................4-26Printing counter ..............................................4-32Printing motion ............................................... 4-41Printing position data ..................................... 4-39Printing position offset .................................... 4-39Printing range ................................................. 4-27Printing state recognition ............................... 4-41Product config .................................................. 2-3Production ........................................................ 2-3RRail width adjustment ....................................... 3-7Recog unit maint ...................................... 2-7, 7-1Recognition ...................................................... 5-2Recognition area ..............................................5-3Recognition mode .......................................... 4-22Recognition position ....................................... 4-46Recognition result correction ........................... 8-3Recognition unit maintenance ........................ 7-14Reflecting printing conditions data on library data .. 4-37Case of PT specification ........................ 4-37Case of PT-less specification ................. 4-38Removing the board under holder ................... 3-6Return to origin ................................................. 7-1Returning printing conditions data to library data . 4-35Case of PT specification ........................ 4-35Case of PT-less specification ................. 4-36Returning to origin ............................................ 7-2SSampling check .............................................. 4-41Saving data ...................................................... 6-8Sent out air of solvent ...................................... 2-7Setting the board holder ................................. 3-13Setting the board pickup box and plate .......... 3-11Setting the board support pins ....................... 3-10Setting the board under holder ...................... 3-10Setting the board under holder block ............. 3-11Setting the board under holder plate on the movable side . 3-9Setting the mask ............................................ 3-22Setting the operator customization .................. 8-6Setting the reversing distance of board ........... 8-5Shape set recognition ...................................... 5-2Solder autodispensing ................................... 4-41Solder dispense ............................................. 4-32Solder recognition .......................................... 4-23Solder recognition counter ............................. 4-22Solder supply ........................................... 7-1, 7-8Specifications of board ..................................... 1-9Specifications of device ................................... 1-6Specifications of machine ................................ 1-6Speed ............................................................. 4-29Square squeegee holder ................................ 1-12Squeegee ....................................................... 4-26Squeegee open and close ..................... 2-7, 7-10Squeegee open/close ...................................... 7-1Squeegee parallel adjustment ....................... 1-12Stop position .................................................. 4-11Storing the solder paste ................................... 1-3Suction ........................................................... 4-29