Quectel M10 Hardware Description

Also see for M10: Hardware design User guide AT Command set User guide

Contents

Table Of Contents
Table Of Contents
Table Of Contents
Table Of Contents
Revision history
Introduction
Terms and abbreviations
Safety caution
Product concept
Functional diagram
Evaluation board
Application interface
Operating modes
Power supply
FIGURE 2: REFERENCE CIRCUIT OF THE VBAT INPUT
Power supply pins
Power up and power down scenarios
FIGURE 6: TURN ON THE MODULE USING KEYSTROKE
Turn off
FIGURE 8: TIMING OF TURN OFF SYSTEM
FIGURE 9: REFERENCE CIRCUIT FOR EMERG_OFF USING DRIVING CIRCUIT
Restart module using the PWRKEY pin
Power saving
SLEEP mode (slow clock mode)
RTC backup
Serial interfaces
TABLE 9: LOGIC LEVELS OF THE SERIAL PORT AND DEBUG PORT
Function of serial port & debug port supporting
Software upgrade and software debug
FIGURE 18: CONNECTION OF SOFTWARE UPGRADE
Audio interfaces
TABLE 11: PIN DEFINITION OF AUDIO INTERFACE
Microphone interfaces configuration
Speaker interface configuration
FIGURE 24: SPEAKER INTERFACE CONFIGURATION OF AOUT2
Earphone interface configuration
Buzzer
SIM card interface
Design considerations for SIM card holder
TABLE 17: PIN DESCRIPTION (AMPHENOL SIM CARD HOLDER)
LCD interface
Keypad interface
FIGURE 32: REFERENCE CIRCUIT OF THE KEYPAD INTERFACE
Behaviors of the RI
Network status indication
General purpose input & output (GPIO)
TABLE 26: PIN DEFINITION OF THE LIGHT_MOS
Antenna interface
Operating frequencies
Electrical, reliability and radio characteristics
TABLE 31: M10 CONNECTION DIAGRAMS
Absolute maximum ratings
Current consumption
Electro-static discharge
Product information
Mechanics
FIGURE 40: PAD BOTTOM DIMENSIONS（UNIT: MM
Footprint of recommendation
FIGURE 41: FOOTPRINT OF RECOMMENDATION（UNIT: MM
Top view of the module

Quectel M10 Hardware Description Manual pdf 44 page image

M10 Hardware Design3.9.3 Earphone interface configuration1243Amphenol9001-8905-050SPK2PMIC2NMIC2P22uF68R33pFGND GNDAGNDClose to SocketDifferential layout33pFAGND33pF 10pFGND GNDGNDGNDAGNDMOUDLEFigure 26: Earphone interface configurationTable 12: MIC input characteristicsParameter Min Typ Max UnitWorking Voltage 1.2 1.5 2.0 VWorking Current 200 500 uAExternalMicrophoneLoad Resistance2.2 k OhmTable 13: SPK Output CharacteristicsParameter Min Typ Max UnitloadResistance28 32 OhmSingleEndedRef level 0 2.4 VpploadResistance28 32 OhmNormalOutput(SPK1)DifferentialRef level 0 4.8 VppM10_HD_V1.00 - 43 -Quectel

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