Diagrams & Drawings (KL8-HF15000L00)do not use solder containing lead.This product has been manufactured using lead-freesolder in order to help preserve the environment.Because of this, be sure to use lead-free solderwhen carrying out repair work, and never use soldercontaining lead.Lead-free solder has a melting point that is 30–40 °C(86–104 °F) higher than solder containing lead, andmoreover it does not contain lead which attaches easilyto other metals. As a result, it does not melt as easilyas solder containing lead, and soldering will be moredifficult even if the temperature of the soldering iron isincreased.The extra difficulty in soldering means that solderingtime will increase and damage to the components orthe circuit board may easily occur.Because of this, you should use a soldering ironand solder that satisfy the following conditions whencarrying out repair work. Also, soldering work must bedone in a short time.Soldering ironUse a soldering iron which is 70 W or equivalent, andwhich lets you adjust the tip temperature up to 450°C (84 °F) It should also have as good temperaturerecovery characteristics as possible.SolderUse solder with the metal content and composition ratioby weight given in the table below. Do not use solderswhich do not meet these conditions.Metal content Tin (Sn) Silver (Ag) Copper (Cu)Compositionratio by weight 96.5 % 3.0 % 0.5 %Note:If replacing existing solder containing lead with lead-free solder in the soldered parts of products that havebeen manufactured up until now, remove all of theexisting solder at those parts before applying the lead-free solder.Note on Soldering
