u-blox ODIN-W260 System Integration Manual

u-blox ODIN-W260 System Integration Manual Manual pdf 20 page image

ODIN-W2 series - System Integration ManualUBX-14040040 - R03 Advance Information Handling and solderingPage 20 of 333 Handling and solderingNo natural rubbers, hygroscopic materials or materials containing asbestos are employed.3.1 Packaging, shipping, storage and moisture preconditioningFor information pertaining to the ODIN-W2 series reels/tapes, Moisture Sensitivity levels (MSL), shipment andstorage information, and drying for preconditioning, refer to ODIN-W2 series Data Sheet [2] and u-blox PackageInformation Guide [3].3.2 HandlingThe ODIN-W2 series modules are Electro-Static Discharge (ESD) sensitive devices.Ensure ESD precautions are implemented while handling the module.The ESD is the sudden and momentary electric current that flows between two objects at different electricalpotentials caused either by direct contact or induced by an electrostatic field. The term is usually used in theelectronics and other industries to describe momentary unwanted currents that may cause damage to theelectronic equipment.The ESD sensitivity for each pin of the ODIN-W2 series modules (as Human Body Model according to JESD22-A114F) is specified in the ODIN-W2 series Data Sheet [2].The ESD prevention is based on establishing an Electrostatic Protective Area (EPA). The EPA can be a smallworking station or a large manufacturing area. The main principle of an EPA is that there are no highly chargingmaterials near ESD sensitive electronics, all conductive materials are grounded, workers are grounded, andcharge build-up on ESD sensitive electronics is prevented. International standards are used to define typical EPAand can be obtained for example, from International Electrotechnical Commission (IEC) or American NationalStandards Institute (ANSI).In addition to standard ESD safety practices, the following measures should be taken into account whilehandling the ODIN-W2 series modules:• Unless there is a galvanic coupling between the local GND (that is, the work table) and the PCB GND,the first point of contact when handling the PCB, must always be between the local GND and PCB GND.• Before mounting an antenna patch, connect ground of the device.• When handling the module, do not come into contact with any charged capacitors and be careful whencontacting materials that can develop charges (for example, patch antenna, coax cable, soldering ironand so on).• To prevent electrostatic discharge through the RF pin, do not touch any exposed antenna area. If thereis any risk that such exposed antenna area is touched in non ESD protected work area, implementproper ESD protection measures in the design.• When soldering the module, make sure to use an ESD safe soldering iron.For more robust designs, employ additional ESD protection measures on the application device integrating theODIN-W2 series modules, as described in the ESD guidelines section.3.3 Soldering3.3.1 Solder pasteNo clean solder paste is strongly recommended for the ODIN-W2 series modules as it does not require cleaningafter the soldering process. The paste listed in Table 7 meets these criteria: