H3C S12500-X Series Installation Manual

Also see for S12500-X: Card Manual Manual Command reference Configuration guide Configuration Examples

4Gas Max. (mg/m 3 )Cl2 0.01EMIAll electromagnetic interference (EMI) sources, from outside or inside of the switch and applicationsystem, adversely affect the switch in the following ways:• A conduction pattern of capacitance coupling.• Inductance coupling.• Electromagnetic wave radiation.• Common impedance (including the grounding system) coupling.To prevent EMI, perform the following tasks:• If AC power is used, use a single-phase three-wire power receptacle with protection earth (PE) tofilter interference from the power grid.• Keep the switch far away from radio transmitting stations, radar stations, and high-frequencydevices.• Use electromagnetic shielding, for example, shielded interface cables, when necessary.GroundingUsing a good grounding system to protect your switch against lightning shocks, interferences, and ESDis essential to the operating reliability of your switch.Make sure the resistance between the chassis and the ground is less than 1 ohm.For more information about grounding the switch, see "Installing the switch."PowerPerform the following tasks to meet the power requirements:1. Calculate the system power consumption.The system power consumption varies by card type and density. For more information aboutsystem power consumption calculation, see "Appendix A Chassis views and technicalspecifications."2. Identify the number of power modules.The total maximum output power of all power modules must be higher than the system powerconsumption. For more information about available power modules, see "Appendix B FRUs andcompatibility matrixes."3. Verify that the power system at the installation site meets the requirements of the power modules,including the input method and rated input voltage. For more information about power modulespecifications, see "Appendix B FRUs and compatibility matrixes."