Chapter 5. Field replaceable unitsThermal grease . . . . . . . . . . . . . . . . . . . . . . . . . 59Fan bracket . . . . . . . . . . . . . . . . . . . . . . . . . . 60Power cage assembly . . . . . . . . . . . . . . . . . . . . . . 61Hard disk drive backplane . . . . . . . . . . . . . . . . . . . . . 62Media cage . . . . . . . . . . . . . . . . . . . . . . . . . . 63Removing a mcroprocessor . . . . . . . . . . . . . . . . . . . . 64System board . . . . . . . . . . . . . . . . . . . . . . . . . 66System-board option connectors . . . . . . . . . . . . . . . . . 66System-board internal cable connectors . . . . . . . . . . . . . . . 67System-board external connectors . . . . . . . . . . . . . . . . . 67System-board switches and jumpers . . . . . . . . . . . . . . . . 68System-board LEDs . . . . . . . . . . . . . . . . . . . . . . 69Removing the system board and shuttle . . . . . . . . . . . . . . 70The following information describes procedures for removing and installing certainFRU inside the server. Only a qualified service technician is authorized to accessthe FRU described in this section.Important: The field-replaceable unit (FRU) procedures are intended for trainedservicers who are familiar with IBM xSeries products. See the parts listing in“System” on page 106 to determine if the FRU being replaced is acustomer-replaceable unit (CRU) or a FRU.Thermal greaseThis section contains information about removing and replacing the thermal greasebetween the heat sink and the microprocessor. The thermal grease must bereplaced anytime the heat sink has been removed from the top of themicroprocessor and is going to be reused, or when debris is found in the grease.Note:v Read “Installation guidelines” on page 23.v Read the safety notices at Appendix B, “Safety information,” on page 113.v Read “Handling static-sensitive devices” on page 24.Complete the following steps to replace damaged or contaminated thermal greaseon the microprocessor and heat sink:1. Place the heat sink on a clean work surface.2. Remove the cleaning pad from its package and unfold it completely.3. Use the cleaning pad to wipe the thermal grease from the bottom of the heatsink.Note: Be sure that all of the thermal grease is removed.4. Use a clean area of the cleaning pad to wipe the thermal grease from themicroprocessor; then, dispose of the cleaning pad after all of the thermal grease© Copyright IBM Corp. 2004 59