33TK-3118TK-260 :K, K2ADJUSTMENT / 调整Replacing Q22 (FET TX final)1. Place Q22 in its location, upside down as shown in figure 1.Make sure the location of each pin is correct. The bevellededge is located between pin 1 and 2. (See the figure below)Replace the heat conductor sheet (G11-2664-x4) whenreplacing Q22.2. The bottom surface of Q22 must be firmly contacted to theTX-RX PCB.Solder each pin onto the top of the metal posts. Make surethe solder is between the pin and the metal post (Refer tofigure 2).Note:• Make sure you are properly grounded while soldering theQ22.• Avoid adding excess solder to the metal post.• Make sure the bottom surface of Q22 is firmly contacted tothe TX-RX PCB.• The metal posts for the pins are also soldered to the PCB.So, when you solder the Q22 pins to the metal posts, keepthe soldering time as short as possible so that the posts arenot moved.重置Q22 (FET 发射终端)1. 如图1所示,将Q22上下颠倒放在它的对应位置。每个管脚的位置一定要正确。斜角位于管脚1与管脚2之间。(如下图所示)当置换Q22时,重置热导膜(G11-2664-x4)。2. Q22的底部表面必须与发射-接收PCB紧密结合。将每个管脚与金属杆的顶端焊接起来。焊剂必须位于管脚与金属杆之间。(参见图2)注释:• 当焊接Q22时一定要将焊剂碾磨恰当。• 避免向金属杆添加过多焊剂。• Q22的底部表面一定要与发射-接收PCB紧密结合。• 管脚所对应的金属杆也要与PCB焊接在一起。所以,将Q 2 2 管脚与金属杆焊接起来时,尽可能使焊接时间越短越好,这样金属杆不易被移动。Fig. 1 / 图1Fig. 2 / 图2Wrong! The bottom surface must be firmly contacted to the PCB.错误!底部表面必须与PCB紧密结合。Q22Q22Excessive soldering / 过度焊接 Good soldering / 焊接良好Metal post / 金属杆TC1 1st IFTC2LVQ22SGD1 24 3Bevelled edge / 斜角Metal post金属杆TX-RX UNIT A/3 Foil sidePCB