General Procedures and Information6-54 11/05 Workcentre PE 220GP 11 Acronyms and AbbreviationsThe table below explains the abbreviations and acronyms used in this service manual. Where ab-breviations or acronyms are used in the text please refer to this table.Table 1: Acronyms and AbbreviationsAbbreviations ExplanationAP Access PointAC Alternating CurrentAPC Auto Power ControlASIC Application Specific Integrated CircuitBIOS Basic Input Output SystemBLDC Brush-less Direct CurrentCN connectorCON connectorCPU Central Processing UnitdB decibeldbA decibel AdBM decibel milliwattDC direct currentDCU Diagnostic Control UnitDPI Dot Per InchDRAM Dynamic Random Access MemoryDVM Digital VoltmeterECP Enhanced Capability PortEDC Embedded Diagnostic controlEEPROM Electronically Erasable Programmable Read Only MemoryEMI Electro Magnetic InterferenceEP electrophotographicEPP Enhanced Parallel PortFPOT First Printout TimeF/W firmwareGDI graphics device interfaceGND groundHBP Host Based PrintingHDD Hard Disk DriveH/H High temperature and high humidityHV high voltageHVPS High Voltage Power SupplyI/F interfaceI/O Input and OutputIC integrated circuitIDE Intelligent Drive electronics or Embedded Drive ElectronicsIEEE Institute of Electrical and Electronics Engineers. Inc.IPA Isopropy AlcoholIPM Images Per Minute
