SARA-R4 series - System Integration ManualUBX-16029218 - R06 Design-inPage 73 of 1022.10 Module placementAn optimized placement allows a minimum RF line’s length and closer path from DC source for VCC.Make sure that the module, analog parts and RF circuits are clearly separated from any possible source ofradiated energy. In particular, digital circuits can radiate digital frequency harmonics, which can produce Electro-Magnetic Interference that affects the module, analog parts and RF circuits’ performance. Implement propercountermeasures to avoid any possible Electro-Magnetic Compatibility issue.Make sure that the module, RF and analog parts / circuits, and high speed digital circuits are clearly separatedfrom any sensitive part / circuit which may be affected by Electro-Magnetic Interference, or employcountermeasures to avoid any possible Electro-Magnetic Compatibility issue.Provide enough clearance between the module and any external part: clearance of at least 0.4 mm per side isrecommended to let suitable mounting of the parts.The heat dissipation during continuous transmission at maximum power can significantly raise thetemperature of the application base-board below the SARA-R4 series modules: avoid placing temperaturesensitive devices close to the module.