u-blox SARA-R4 Series System Integration Manual

Contents

SARA-R4 series - System Integration ManualUBX-16029218 - R06 Design-inPage 74 of 1022.11 Module footprint and paste maskFigure 41 and Table 30 describe the suggested footprint (i.e. copper mask) and paste mask layout for SARAmodules: the proposed land pattern layout reflects the modules’ pins layout, while the proposed stencilapertures layout is slightly different (see the F’’, H’’, I’’, J’’, O’’ parameters compared to the F’, H’, I’, J’, O’ ones).The Non Solder Mask Defined (NSMD) pad type is recommended over the Solder Mask Defined (SMD) pad type,implementing the solder mask opening 50 μm larger per side than the corresponding copper pad.The recommended solder paste thickness is 150 μm, according to application production process requirements.KM1M1M2E G H’ J’ EANT pinBPin 1KGH’J’ADDO’O’L N LI’F’F’KM1M1M2E G H’’ J’’ EANT pinBPin 1KGH’’J’’ADDO’’O’’L N LI’’F’’F’’Stencil: 150μmFigure 41: SARA-R4 series modules suggested footprint and paste mask (application board top view)Parameter Value Parameter Value Parameter ValueA 26.0 mm G 1.10 mm K 2.75 mmB 16.0 mm H’ 0.80 mm L 2.75 mmC 3.00 mm H’’ 0.75 mm M1 1.80 mmD 2.00 mm I’ 1.50 mm M2 3.60 mmE 2.50 mm I’’ 1.55 mm N 2.10 mmF’ 1.05 mm J’ 0.30 mm O’ 1.10 mmF’’ 1.00 mm J’’ 0.35 mm O’’ 1.05 mmTable 30: SARA-R4 series modules suggested footprint and paste mask dimensionsThese are recommendations only and not specifications. The exact copper, solder and paste maskgeometries, distances, stencil thicknesses and solder paste volumes must be adapted to the specificproduction processes (e.g. soldering etc.) of the customer.