User’s Manual U14826EJ5V0UD 197CHAPTER 23 RECOMMENDED SOLDERING CONDITIONSTheμPD789860, 789860(A), 789861, 78E9860A, and 78E9861A should be soldered and mounted under thefollowing recommended conditions.For soldering methods and conditions other than those recommended below, contact an NEC Electronics salesrepresentative.For technical information, see the following website.Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index/html)Table 23-1. Surface Mounting Type Soldering Conditions (1/2)μPD789860MC-×××-5A4: 20-pin plastic SSOP (7.62 mm (300))μPD789861MC-×××-5A4: 20-pin plastic SSOP (7.62 mm (300))μPD789860MC(A)-×××-5A4: 20-pin plastic SSOP (7.62 mm (300))Soldering Method Soldering Conditions RecommendedCondition SymbolInfrared reflow Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),Count: three times or lessIR35-00-3VPS Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),Count: three times or lessVP15-00-3Wave soldering Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,Preheating temperature: 120°C max. (package surface temperature)WS60-00-1Partial heating Pin temperature: 300°C max. Time: 3 seconds max. (per pin row) −Caution Do not use different soldering method together (except for partial heating).
