WAGO-I/O-SYSTEM 750 Device Description 17750-464 2/4 AI RTD configurableManualVersion 1.0.1Pos : 23 /All e Seri en (Allgemei ne Module)/Ü berschriften für alle Serien/Gerätebesc hreibung/Ansc hlüsse - Übersc hrift 2 @ 4\mod_1240984262656_21.doc x @ 31961 @ 2 @ 13.2 ConnectorsPos : 24 /Serie 750 ( WAGO-I/O-SYST EM)/Ger ätebesc hrei bung/Ansc hl üss e/Datenkontakte/Kl emmenbus - Ü bersc hrift 3 @ 6\mod_1256294684083_21.doc x @ 43660 @ 3 @ 13.2.1 Data Contacts/Internal BusPos : 25.1 /Serie 750 (WAGO-I/O-SYST EM)/Ger ätebesc hrei bung/Ansc hl üsse/Datenkontakte @ 3\mod_1231771259187_21.doc x @ 26002 @ @ 1Communication between the coupler/controller and the I/O modules as well as thesystem supply of the I/O modules is carried out via the internal bus. It iscomprised of 6 data contacts, which are available as self-cleaning gold springcontacts.Figure 2: Data contactsPos : 25.2 /Serie 750 (WAGO-I/O-SYST EM)/Wic htige Erläuterungen/Sicherheits- und sonstig e Hinweis e/Achtung/Achtung: Bus kl emmen nic ht auf Goldfeder kontakte leg en! @ 7\mod_1266318463636_21.doc x @ 50695 @ @ 1Do not place the I/O modules on the gold spring contacts!Do not place the I/O modules on the gold spring contacts in order to avoid soilingor scratching!Pos : 25.3 /Serie 750 (WAGO-I/O-SYST EM)/Wic htige Erläuterungen/Sicherheits- und sonstig e Hinweis e/Achtung/Achtung: ESD - Auf g ute Erdung der U mgebung ac hten! @ 7\mod_1266318538667_21.doc x @ 50708 @ @ 1Ensure that the environment is well grounded!The modules are equipped with electronic components that may be destroyed byelectrostatic discharge. When handling the modules, ensure that the environment(persons, workplace and packing) is well grounded. Avoid touching conductivecomponents, e.g. data contacts.Pos : 26 /D okumentation allgemei n/Glieder ungs elemente/---Seitenwechs el--- @ 3\mod_1221108045078_0.doc x @ 21810 @ @ 1