Chapter 4. Field replaceable unitsThermal grease . . . . . . . . . . . . . . . . . . . . . . . . . 47Fan bracket . . . . . . . . . . . . . . . . . . . . . . . . . . 48Power cage assembly . . . . . . . . . . . . . . . . . . . . . . 49Hard disk drive backplane . . . . . . . . . . . . . . . . . . . . . 50Media cage . . . . . . . . . . . . . . . . . . . . . . . . . . 51Removing a microprocessor . . . . . . . . . . . . . . . . . . . . 52System board . . . . . . . . . . . . . . . . . . . . . . . . . 54System-board option connectors . . . . . . . . . . . . . . . . . 54System-board internal cable connectors . . . . . . . . . . . . . . . 55System-board external connectors . . . . . . . . . . . . . . . . . 55System-board switches and jumpers . . . . . . . . . . . . . . . . 56System-board LEDs . . . . . . . . . . . . . . . . . . . . . . 57Removing the system board and shuttle . . . . . . . . . . . . . . 58The following information describes procedures for removing and installing certainFRU inside the server. Only a qualified service technician is authorized to accessthe FRU described in this section.Important: The field-replaceable unit (FRU) procedures are intended for trainedservicers who are familiar with IBM xSeries products. See the parts listing in“System” on page 108 to determine if the FRU being replaced is acustomer-replaceable unit (CRU) or a FRU.Thermal greaseThis section contains information about removing and replacing the thermal greasebetween the heat sink and the microprocessor.Important: If you are installing the heat sink on the same processor that it wasremoved from, be sure that:v The thermal grease on the heat sink and microprocessor is not contaminated.v Addition thermal grease is not added to the existing thermal grease on the heatsink and microprocessor.Note:v Read “Installation guidelines” on page 11.v Read the safety notices at Appendix B, “Safety information,” on page 117.v Read “Handling static-sensitive devices” on page 13.Complete the following steps to replace damaged or contaminated thermal greaseon the microprocessor and heat sink:1. Place the heat sink on a clean work surface.2. Remove the cleaning pad from its package and unfold it completely.3. Use the cleaning pad to wipe the thermal grease from the bottom of the heatsink.Note: Be sure that all of the thermal grease is removed.4. Use a clean area of the cleaning pad to wipe the thermal grease from themicroprocessor; then, dispose of the cleaning pad after all of the thermal greaseis removed.© Copyright IBM Corp. 2005, 2007 47