NXP Semiconductors MPC5777M Datasheet

Also see for MPC5777M: Safety manual

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NXP Semiconductors MPC5777M Datasheet Manual pdf 131 page image

Electrical characteristicsMPC5777M Microcontroller Data Sheet, Rev. 6NXP Semiconductors 1313.20 Thermal characteristicsThe following tables describe the thermal characteristics of the device..3.20.1 General notes for specifications at maximum junction temperatureAn estimation of the chip junction temperature, T J , can be obtained from the equation:T J = TA + (RJA * P D) Eqn. 1where:TA = ambient temperature for the package (oC)RJA = junction-to-ambient thermal resistance (o C/W)PD = power dissipation in the package (W)The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide consistent values forestimations and comparisons. The difference between the values determined for the single-layer (1s) board compared to afour-layer board that has two signal layers, a power and a ground plane (2s2p), demonstrate that the effective thermal resistanceis not a constant. The thermal resistance depends on the:Table 74. Thermal characteristicsSymbol Parameter Conditions 416Value512Value Unit NotesRJA Junction-to-Ambient, NaturalConvectionSingle Layer board (1s) 25 24.1 °C/W 1,21 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance,mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components onthe board, and board thermal resistance.2 Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.Four layer board (2s2p) 17.2 16.8 1,2,33 Per JEDEC JESD51-6 with the board horizontal.RJMA Junction-to-Moving-Air, Ambient @200 ft/min., single layerboard (1s)18.1 16.6 °C/W 1,3@200 ft/min., four layer board(2s2p)13.4 12.4 1,3RJB Junction-to-board — 8.6 8.8 °C/W 44 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature ismeasured on the top surface of the board near the package.RJC Junction-to-case — 5.0 5.0 °C/W 55 Thermal resistance between the die and the case top surface as measured by the cold plate method (MILSPEC-883 Method 1012.1).JT Junction-to-package top Natural convection 0.2 0.2 °C/W 66 Thermal characterization parameter indicating the temperature difference between package top and thejunction temperature per JEDEC JESD51-2.JB Junction-to-package bottom/solderballsNatural convection 3.5 3.0 °C/W 77 Thermal characterization parameter indicating the temperature difference between package bottom center andthe junction temperature per JEDEC JESD51-12.