18 Device Description WAGO-I/O-SYSTEM 750750-658 CAN GatewayManualVersion 1.2.0, valid from FW/HW-Version 01/01Pos : 29 /All e Seri en (Allgemei ne Module)/Ü berschriften/Ebene 2/Ansc hlüss e - Übersc hrift 2 @ 4\mod_1240984262656_21.doc x @ 31961 @ 2 @ 14.2 ConnectorsPos : 30 /Serie 750 ( WAGO-I/O-SYST EM)/Ger ätebesc hrei bung/Ansc hl üss e/Datenkontakte/Kl emmenbus - Ü bersc hrift 3 @ 6\mod_1256294684083_21.doc x @ 43660 @ 3 @ 14.2.1 Data Contacts/Internal BusPos : 31.1 /Serie 750 (WAGO-I/O-SYST EM)/Ger ätebesc hrei bung/Ansc hl üsse/Datenkontakte - F eldbus koppler/-c ontroll er, Abbildung und Besc hrei bung @ 3\mod_1231771259187_21.doc x @ 26002 @ @ 1Communication between the fieldbus coupler/controller and the I/O modules aswell as the system supply of the I/O modules is carried out via the internal bus. Itis comprised of 6 data contacts, which are available as self-cleaning gold springcontacts.Figure 2: Data ContactsPos : 31.2 /Serie 750 (WAGO-I/O-SYST EM)/Wic htige Erläuterungen/Sicherheits- und sonstig e Hinweis e/Achtung/Achtung: Bus kl emmen nic ht auf Goldfeder kontakte leg en! @ 7\mod_1266318463636_21.doc x @ 50695 @ @ 1Do not place the I/O modules on the gold spring contacts!Do not place the I/O modules on the gold spring contacts in order to avoid soilingor scratching!Pos : 31.3 /Serie 750 (WAGO-I/O-SYST EM)/Wic htige Erläuterungen/Sicherheits- und sonstig e Hinweis e/Achtung/Achtung: ESD - Auf g ute Erdung der U mgebung ac hten! @ 7\mod_1266318538667_21.doc x @ 50708 @ @ 1Ensure that the environment is well grounded!The devices are equipped with electronic components that may be destroyed byelectrostatic discharge. When handling the devices, ensure that the environment(persons, workplace and packing) is well grounded. Avoid touching conductivecomponents, e.g. data contacts.Pos : 32 /D okumentation allgemei n/Glieder ungs elemente/---Seitenwechs el--- @ 3\mod_1221108045078_0.doc x @ 21810 @ @ 1