Contents - Table Of Contents
- Table Of Contents
- Table Of Contents
- Figures
- Tables
- Preface
- Revision history
- Chapter 1 Pre-planning tasks
- Before you begin
- VMAX All Flash packaging
- Chapter 2 Delivery and transportation
- Delivery arrangements
- Shipping and storage environmental requirements
- Chapter 3 Specifications
- Radio frequency interference
- Power consumption and heat dissipation
- Adaptive cooling
- Airflow
- Air volume, air quality, and temperature
- Air quality requirements
- Shock and vibration
- Hardware acclimation times
- Optical multimode cables
- Chapter 4 Data Center Safety and Remote Support
- Fire suppressant disclaimer
- Chapter 5 Physical weight and space
- Floor load-bearing capacity
- Physical space and weight
- Chapter 6 Position VMAX 250F Bay
- Bay layout and dimensions
- Tile placement
- Cabinet stabilizing
- Chapter 7 Position VMAX 450F, VMAX 850F, VMAX 950F Bays
- System bay layouts
- Adjacent layouts, VMAX 450F, VMAX 850F, VMAX 950F
- Dispersed layout, VMAX 450F, VMAX 850F, VMAX 950F
- Adjacent and dispersed (mixed) layout
- Dimensions for array layouts
- Caster and leveler dimensions
- Chapter 8 Power cabling, cords and connectors
- Power distribution equipment, VMAX 250F
- Power distribution unit VMAX 450F, VMAX 850F, VMAX 950F
- Wiring configurations, VMAX 250F
- Wiring configurations, VMAX 450F, VMAX 850F, VMAX 950F
- Power interface
- VMAX 250F customer AC power feed cabling
- Best practices: Power configuration guidelines
- Single-phase
- Three-phase (International (Wye))
- Three-phase (North American (Delta))
- Three-phase (Wye, Domestic)
- Chapter 9 EMC racking for VMAX 250F
- Two system configurations
- Chapter 10 Third Party Racking Option for VMAX 250F
- Computer room requirements, VMAX 250F
- PDU requirements for third party racks, VMAX 250F
- Power distribution equipment for third-party rack, VMAX 250F
- Chapter 11 Third Party Racking Option for VMAX 450F, VMAX 850F and VMAX 950F
- Computer room requirements
- Customer rack requirements
- Third party racks with vertical PDUs — RPQ Required
- Requirements for third party racks with vertical PDUs (rear-facing
- Requirements for third party racks with vertical PDUs (inward facing)
- Chassis to chassis grounding
- Chapter 12 Optional kits
- Overhead routing kit
- Dispersion kits, VMAX 950F
- Securing kits
- Appendix A Best Practices for AC Power Connections
- Best practices overview for AC power connections
- Selecting the proper AC power connection procedure
- Procedure A: Working with the customer's electrician onsite
- Procedure A, Task 1: Customer's electrician
- Procedure A, Task 2: EMC Customer Engineer
- Procedure A, Task 2: EMC Customer Engineer (VMAX 250F)
- Procedure A, Task 3: Customer's electrician
- Procedure B: Verify and connect
- Procedure C: Obtain customer verification
- Applying PDU labels, VMAX 250F
- Applying PDU labels, VMAX 450F, VMAX 850F, VMAX 950F
- AC power specifications
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AirflowSystems are designed for typical hot aisle/cold aisle data center cooling environmentsand installation:l On raised or nonraised floors.l In hot aisle/cold aisle arrangements.The airflow provides less mixing of hot and cold air, which can result in a higher returntemperature to the computer room air conditioner (CRAC). This promotes better heattransfer outside the building and achieves higher energy efficiency and lower PowerUsage Effectiveness (PUE). Additional efficiency can be achieved by sequestering theexhaust air completely and connecting ducts directly to a CRAC unit or to the outside.Best practice is to place a perforated floor tile in front of each bay to allow adequatecooling air supply when installing on a raised floor. The following figure shows typicalairflow in a hot aisle/ cold aisle environment.Figure 1 Typical airflow in a hot/cold aisle environment5654 487 991 1223Table 7 Airflow diagram key# Description # Description1 To refrigeration unit 6 Hot aisle2 Suspended ceiling 7 Perforated rear doors3 Air return 8 Pressurized floor4 System bays 9 Perforated floor tile5 Cold aisleSpecificationsAirflow 27
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