Xilinx Zynq-7000 Design Manual

Also see for Zynq-7000: Quick start guide Getting started guide User guide Application note User guide

Zynq-7000 PCB Design Guide www.xilinx.com 69UG933 (v1.8) November 7, 2014Chapter 6Migration from XC7Z030-SBG485 toXC7Z015-CLG485 DevicesIntroductionPackage migration across a device family is a common feature among Xilinx devices. Thepinout remains consistent, with the biggest difference being more available I/Os in biggerpackages. However, a unique case arises when migrating from an XC7Z030-SBG485 deviceto an XC7Z015-CLG485 device, as there are more significant differences between thedevices other than pinout. The designer wishing to migrate between these two devicesneeds to be aware of these differences.Differences between XC7Z030-SBG485 andXC7Z015-CLG485 DevicesWhen migrating from an XC7Z030-SBG485 device to an XC7Z015-CLG485 device, some keydifferences should be noted in regards to functionality, performance, packaging,transceivers, PCB layout, and software (see Table 6-1).Table 6-1: Key Differences Between XC7Z030-SBG485 and XC7Z015-CLG485 DevicesXC7Z030-SBG485 XC7Z015-CLG485Die/Fabric Kintex-7 Artix-7Package Type Bare/Flip Chip WirebondProcessor Speed 1 GHz 800 MHzPower Supply Tolerance 3% 5%Bank 34, pins H8/R8 VRP/VRN (for DCI) No DCIBank 35, pins H5/H6 VRP/VRN (for DCI) No DCIBank 34 HP I/Os HR I/OsBank 35 HP I/Os HR I/OsBank 112 (MGT) GTX GTPBank 112, pin V7 MGTAVTTRCAL Not connectedSend Feedback