TB8100 Service Manual Safety and Servicing Information 25© Tait Electronics Limited September 20061.7 Replacing ComponentsEnsure that any replacement components are of the same type andspecifications as the originals. This will prevent the performance and safetyof the TB8100 equipment from being degraded.1.7.1 Surface Mount DevicesImportant Surface mount devices (SMDs) require special storage, han-dling, removal and replacement techniques. This equip-ment should be serviced only by an approved Tait Dealer orCustomer Service Organisation equipped with the neces-sary facilities. Repairs attempted with incorrect equipmentor by untrained personnel may result in permanent damage.If in doubt, contact your nearest Tait Dealer or CustomerService Organisation.1.7.2 Leaded ComponentsWhenever you are doing any work on the PCB that involves removing orfitting components, you must take care not to damage the copper tracks orpads. The two satisfactory methods of removing components from plated-through hole (PTH) PCBs are detailed below.Desoldering IronMethod This method requires the use of a desoldering station.1. Place the tip over the lead and, as the solder starts to melt, move thetip in a circular motion.1. Start the suction and continue the movement until three or fourcircles have been completed.2. Remove the tip while continuing suction to ensure that all solder isremoved from the joint, then stop the suction.3. Before pulling the lead out, ensure it is not stuck to the plating.4. If the lead is still not free, resolder the joint and try again.Note The desoldering iron does not usually have enough heat to desol-der leads from the ground plane. Additional heat may be appliedby holding a soldering iron on the tip of the desoldering iron (thismay require some additional help).
