Quorum Q150T S Instruction Manual
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Contents
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Q150T Sample Preparation SystemQ150T - Instruction Manual 3 10473 - Issue 5ContentsSection Contents1 Introduction .......................................................................................................... 81.1 General Description ......................................................................................... 81.2 Sputter Coating................................................................................................ 91.3 Carbon Coating................................................................................................ 91.4 Metal Evaporation ............................................................................................ 91.5 Aperture Cleaning ............................................................................................ 92 Installation .......................................................................................................... 102.1 Pre-installation............................................................................................... 102.1.1 Required Services .......................................................................................................102.2 Unpacking...................................................................................................... 112.3 Connections................................................................................................... 122.3.1 Gas Connections ........................................................................................................132.3.2 Electrical Connections.................................................................................................142.3.3 Aux Network Connection.............................................................................................142.3.4 Vacuum Connections ..................................................................................................152.3.5 Fitting the Standard Stage...........................................................................................162.3.6 Optional Connections ..................................................................................................163 Operation ............................................................................................................ 173.1 Switching On for the First Time ...................................................................... 173.1.1 The Standby screen ....................................................................................................173.2 Running a Profile ........................................................................................... 183.3 System Settings ............................................................................................. 204 Working with Profiles......................................................................................... 214.1 Editing the Active Profile ................................................................................ 214.2 Profile Editor .................................................................................................. 214.2.1 Creating a New Profile ................................................................................................234.2.2 Editing Profile Parameters...........................................................................................244.3 Materials ........................................................................................................ 254.3.1 Creating a New Material ..............................................................................................264.3.2 Editing Material Parameters ........................................................................................264.3.3 Deleting a Material.......................................................................................................275 Application Guidelines ...................................................................................... 285.1 QT Timed Sputter .......................................................................................... 285.1.1 Tungsten SEM work....................................................................................................285.1.2 High resolution SEM coatings for field emission SEM ................................................285.1.3 Aluminium thin film......................................................................................................295.2 QT FTM Terminated Sputter........................................................................... 305.2.1 High resolution SEM coatings for field emission SEM ................................................305.2.2 General thin film coatings............................................................................................305.3 Metal Evaporation .......................................................................................... 315.3.1 How to achieve a 20nm gold coating ...........................................................................315.4 Pulsed Cord Evaporation................................................................................ 325.4.1 How to create a 20nm carbon coating .........................................................................325.5 Controlled Pulse Cord Evaporation................................................................. 325.5.1 Using Controlled Pulse to create a 15nm coat or 2-3nm for EBSD.............................325.6 Pulsed Rod Evaporation................................................................................. 345.6.1 How to create a conductive layer for SEM...................................................................345.7 Ramped Profile .............................................................................................. 355.7.1 Carbon insert setup.....................................................................................................355.7.2 The ramped current profile..........................................................................................365.7.3 Adjusting coating thickness.........................................................................................375.7.4 How to create a carbon support layer For TEM...........................................................37How to create a conductive carbon layer for SEM ....................................................................385.8 Using Outgas Source options ......................................................................... 395.8.1 Setting Outgas Source options ...................................................................................395.8.2 Running Multiple Outgassing ......................................................................................395.9 Glow Discharge.............................................................................................. 405.9.1 Hydrophilisation...........................................................................................................405.9.2 Surface Cleaning.........................................................................................................40 |
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