Q150T Sample Preparation System10473 - Issue 5 78 Q150T - Instruction Manual9 Appendices9.1 Profile ParametersOperation of the Q150T is controlled by a process profile. There are several types ofprofile as listed in Table 24. Each profile contains a number of adjustable parameters.The following tables list the parameters available in each type of profile, showing theirdefault values and allowed ranges.Table 24 FTM/Timed Sputter Coating parametersName DefaultValueMinimumValueMaximumValueCommentMaterial Gold Target Material required for thisprocessSputter Current(mA)20 1 50 Coating currentUpdated from material listSputter Time(seconds)120 1 3600 Timed Sputter onlyStops sputtering at set time.TerminateThickness (nm)1 2000 FTM Terminated Sputter onlyStops sputtering when the FTMreads this thicknessMaximum SputterTime (minutes)4.0 0 60.0 FTM Terminated Sputter onlySets upper limit to sputtering ifFTM thickness has not beenachievedTooling Factor 2.3 0.1 10 Tooling factor for this processThis is multiplied by that in thematerial list.Clean target* No No Yes Clean target before coatingFlush chamber* No No Yes Flush chamber with nitrogenbefore pumping down.* Admin group level required to edit this property
