G3 Series EtherNet/IP Technical ManualPage 38TDG3EPTM1-1EN 05/09Subject to change without noticewww.numatics.com/g3DistributionDistribution of I/O capability can be easily achieved with the G3 platform by means of Sub-Bus modules.I/O modules, valve manifolds and/or a combination of both can be simply separated from the main manifoldand distributed via a sub-bus communication cable. The G3 platform uses the same I/O modules on themain manifold as on the distribution chain. The main communication module can control up to 16 I/Omodules either on the main manifold or as part of the sub-bus connections. To utilize the sub-busdistribution capabilities the Sub-Bus OUT module must be located on the end of the main communicationmanifold and a Terminator Module must be located at the last sub-bus component.Example 1Detail No. Description1 Main Communication Module (Node)2 Sub-Bus Power Cable (Can be connected to additional power supply)3 Distributed Sub-Bus Valve Module4 Sub-Bus IN module5 Sub-Bus OUT module6 Sub-Bus Communication Cable7 I/O Modules8 Terminator Module4568DistributedSub-BusI/OModulesDistributedSub-Bus ValveManifoldwith I/O7 4 77Fieldbus network312Main FieldbusValve Manifoldwith I/OPowerSupply755
