Replacing the upper power supply card inthe power-supply paddle card assembly . . 222Removing the lower power supply card fromthe power-supply paddle card assembly . . 224Replacing the lower power supply card inthe power-supply paddle card assembly . . 226Removing the hot-swap hard disk drivebackplane . . . . . . . . . . . . 230Replacing the hot-swap hard disk drivebackplane . . . . . . . . . . . . 232Removing the hot-swap backplane on therear hard disk drive cage . . . . . . . 233Replacing the hot-swap backplane on therear hard disk drive cage . . . . . . . 236Removing and replacing Tier 2 CRUs . . . . 238Removing a microprocessor and heat sink 238Replacing a microprocessor and heat sink 243Removing the system board . . . . . . 251Replacing the system board . . . . . . 255Removing and replacing consumable andstructural parts . . . . . . . . . . . . 258Removing the server top cover . . . . . 258Replacing the server top cover . . . . . 260Removing the air baffle . . . . . . . . 261Replacing the air baffle . . . . . . . . 262Removing the paddle card safety cover(240VA cover) . . . . . . . . . . . 263Replacing the paddle card safety cover(240VA cover) . . . . . . . . . . . 264Appendix A. Integrated managementmodule II (IMM2) error messages . . . 265IMM Events that automatically notify Support . . 266Appendix B. UEFI/POST error codes 591Appendix C. DSA diagnostic testresults . . . . . . . . . . . . . . 611DSA Broadcom network test results . . . . . . 611DSA Brocade test results. . . . . . . . . . 620DSA checkpoint panel test results . . . . . . 628DSA CPU stress test results. . . . . . . . . 629DSA Emulex adapter test results . . . . . . . 632DSA EXA port ping test results . . . . . . . 635DSA hard drive test results . . . . . . . . . 637DSA Intel network test results . . . . . . . . 639DSA LSI hard drive test results . . . . . . . 644DSA Mellanox adapter test results . . . . . . 645DSA memory isolation test results . . . . . . 648DSA memory stress test results . . . . . . . 718DSA Nvidia GPU test results . . . . . . . . 721DSA optical drive test results . . . . . . . . 727DSA system management test results . . . . . 731DSA tape drive test results . . . . . . . . . 742Appendix D. Getting help andtechnical assistance . . . . . . . . 747Before you call . . . . . . . . . . . . . 747Using the documentation . . . . . . . . . 748Getting help and information from the World WideWeb . . . . . . . . . . . . . . . . 748How to send DSA data to IBM . . . . . . . 748Creating a personalized support web page . . . 749Software service and support . . . . . . . . 749Hardware service and support . . . . . . . 749IBM Taiwan product service . . . . . . . . 749Notices . . . . . . . . . . . . . . 751Trademarks . . . . . . . . . . . . . . 752Important notes . . . . . . . . . . . . 752Particulate contamination . . . . . . . . . 753Documentation format . . . . . . . . . . 754Telecommunication regulatory statement . . . . 754Electronic emission notices . . . . . . . . . 755Federal Communications Commission (FCC)statement. . . . . . . . . . . . . . 755Industry Canada Class A emission compliancestatement. . . . . . . . . . . . . . 755Avis de conformité à la réglementationd'Industrie Canada . . . . . . . . . . 755Australia and New Zealand Class A statement 755European Union EMC Directive conformancestatement. . . . . . . . . . . . . . 756Germany Class A statement . . . . . . . 756Japan VCCI Class A statement. . . . . . . 757Japan Electronics and Information TechnologyIndustries Association (JEITA) statement . . . 758Korea Communications Commission (KCC)statement. . . . . . . . . . . . . . 758Russia Electromagnetic Interference (EMI) ClassA statement . . . . . . . . . . . . . 758People's Republic of China Class A electronicemission statement . . . . . . . . . . 758Taiwan Class A compliance statement . . . . 759Power cord safety statement. . . . . 761Index . . . . . . . . . . . . . . . 763Contents v
