Appendix A MCU Electrical SpecificationsMC9S12ZVMB Family Reference Manual Rev. 1.3678 NXP SemiconductorsTable A-9. Thermal Package Characteristics For 48LQFP1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, board temperature,ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance2. Per JEDEC JESD51-2 with natural convection for horizontally oriented board. Board meets JESD51-9 specification for1s or 2s2p board respectively.3. Per JEDEC JESD51-6 with forced convection for horizontally oriented board. Board meets JESD51-9 specification for 1sor 2s2p board respectively.4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measuredon the top surface of the board near the package.5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883Method 1012.1).6. Thermal characterization parameter indicating the temperature difference between package top and the junctiontemperature per JEDEC JESD51-2Num Rating (1)1. The values for thermal resistance are achieved by package simulations. Junction temperature is a function of die size,on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistanceSymbol Min Typ Max Unit1 Thermal resistance, single sided PCB (2) NaturalConvection2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.JA — 82.8 — C/W2 Thermal resistance, double sided PCB 23with 2 internal planes. Natural Convection.JA — 51.4 — C/W3 Thermal resistance,, single sided PCB 3(@200 ft./min)JA — 70.2 — C/W4 Thermal resistance double sided PCB (3)with 2 internal planes (@200 ft./min).3. Junction to ambient thermal resistance, JA equivalent to the JEDEC specification JESD51-6 with the board horizontal.JA — 46.5 — C/W5 Junction to Board (4)4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measuredon the top surface of the board near the package.JB — 28.6 — C/W6 Junction to Case Top (5)5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883Method 1012.1).JCtop — 20.2 — C/W7 Junction to Package Top (6)6. Thermal characterization parameter indicating the temperature difference between package top and the junctiontemperature per JEDEC JESD51-2JT — 1.1 — C/W
